Hello, I’m wondering if I could use an H7 with global shutter module as a smart ‘bottom camera’ for a PCB component pick-and-place machine. The goal is to look at an SMD part held by the nozzle and check whether the rotation or position needs alignment. Ideally this would have “fly-by” capability where the nozzle does not stop over the camera.
The overall procedure would go like:
- Receive package type (eg. 0805, SOT23 etc) to be identified, over UART probably
- Wait for external trigger
- Grab frame buffer and process, probably 320x160 mono
- Output xy offset and rotation over SPI
So far I can’t see any obvious roadblocks to achieving this, let me know if I’m wrong about that. I’m also wondering what kind of time I might expect the processing to take, because if the nozzle gets to the destination first and has to sit around waiting, the advantage of the fly-by is kinda lost. The trigger latency also needs to be highly consistent.