I wanted to share how our team made heatsinks for the H7+, as we kept getting the “solid light of doom” during image processing when deploying outdoors. In our case, outdoors is Texas summer, above 95F, full sun. We ran tests, and it was indeed the high-temperature environment that led to the three H7+s crashing.
The addition of heatsinks was an improvement. Units that were crashing within two minutes without a heatsink, ran for over an hour with the heatsink, we got tired of waiting for them to crash and unplugged them, then formally deployed them later. The crashing was an interaction of processor load, based on how many images per second we were processing, against external temperature. Direct sunlight, heating the H7+ was a secondary factor that was also predictive of failure.
Here are finished heatsinks and a heat-sink specific case. The goal was to have the fins align with the case, not stick out, so they couldn’t get snagged and ripped off. I’m not allowed by the forum to embed step by step photos so I’ll explain in writing.
These are the parts I bought from Digi-Key.
Heat sink rails: PART: ATS2182-ND MFG : Advanced Thermal Solutions Inc. / ATS-EXL58-300-R0
Heatsink thermal past: DESC: HEATSINK AL6063 300X6X8MM 7.93000 7.93.
PART: 3196-TC-GC-03-02-ND MFG : Gelid Solutions LLC / TC-GC-03-02, DESC: THERMAL COMPOUND 10GR, 8.5W
Additionally, I had a tabletop mini-vise, the smallest and cheapest I could find at Home Depot, a hack saw, and a rotary tool stone for removing metal burrs.
To create the heatsink, I placed the heatsink rails side by side in a vice. Using a hacksaw with fresh blade, I made two cuts. First, I cut them to be a generous 1cm square block of fins. Then, I cut the fins of 5mm of the block, leaving the metal base. This created a large area of contact with the processor, while minimizing the chance of the metal heatsink touching the underside of the camera board. This is what the cut heatsink looks like. https://photos.app.goo.gl/N1zpG9pq4RApaU1z5
I removed the camera board, exposing the processor.
Then I used non-conductive thermal paste to attach the heatsink to the chip.
Finally, I edited the available case 3D model to accommodate the heatsink and a solar shade/reflector. Here is a SketchUp file and STL for anyone who wants a case that attaches a heatsink’ed H7+ to a tripod, either Manfrotto quick-release, or insert a quarter-inch nut for typical screw-on mount.
Note, the SketchUp file is 1000X larger, because Sketchup has issues with fine geometry. Just scale your resulting stl.